Lines Matching full:multiple
28 multiple network interfaces into a single logical "bonded" interface.
50 3.1.2 Configuring Multiple Bonds with Sysconfig
53 3.2.2 Configuring Multiple Bonds with Initscripts
55 3.3.1 Configuring Multiple Bonds Manually
71 7.2 Configuring Multiple ARP Targets
85 11.2 High Availability in a Multiple Switch Topology
86 11.2.1 HA Bonding Mode Selection for Multiple Switch Topology
87 11.2.2 HA Link Monitoring for Multiple Switch Topology
93 12.2 Maximum Throughput in a Multiple Switch Topology
94 12.2.1 MT Bonding Mode Selection for Multiple Switch Topology
95 12.2.2 MT Link Monitoring for Multiple Switch Topology
309 Specify these values in ddd.ddd.ddd.ddd format. Multiple IP
375 Validation is useful in network configurations in which multiple
379 generated by the multiple bonding instances will fool the standard
429 value should be a multiple of the miimon value; if not, it
430 will be rounded down to the nearest multiple. The default
490 when multiple ports are programmed with the same MAC
755 This delay should be a multiple of the link monitor interval
839 should be a multiple of the miimon value; if not, it will be
840 rounded down to the nearest multiple. The default value is 0.
915 traffic to a particular network peer to span multiple
917 multiple slaves.
971 shared by multiple virtual machines, all configured to
1077 Before editing, the file will contain multiple lines, and will look
1099 network configuration system will correctly start multiple instances
1145 system if you have multiple bonding devices.
1193 3.1.2 Configuring Multiple Bonds with Sysconfig
1197 handling multiple bonding devices. All that is necessary is for each
1201 multiple bonding devices with identical parameters, create multiple
1282 is the proper syntax to specify multiple targets. When specifying
1315 3.2.2 Configuring Multiple Bonds with Initscripts
1319 Enterprise Linux 5 support multiple bonding interfaces by simply
1323 not support this method for specifying multiple bonding interfaces; for
1324 those instances, see the "Configuring Multiple Bonds Manually" section,
1385 3.3.1 Configuring Multiple Bonds Manually
1388 This section contains information on configuring multiple
1390 initialization scripts lack support for configuring multiple bonds.
1392 If you require multiple bonding devices, but all with the same
1396 To create multiple bonding devices with differing options, it is
1401 provide multiple instances of bonding with differing options is to load
1402 the bonding driver multiple times. Note that current versions of the
1408 To load multiple instances of the module, it is necessary to
1410 requires that every loaded module, even multiple instances of the same
1411 module, have a unique name). This is accomplished by supplying multiple
1441 to configure multiple bonds with differing parameters (as they are older
1453 Use of the sysfs interface allows you to use multiple bonds
1455 It also allows you to use multiple, differently configured bonds when
1699 Any interface that needs a queue_id set should set it with multiple calls
1701 distributions that allow configuration via initscripts, multiple 'queue_id'
1960 7.2 Configuring Multiple ARP Targets
1970 Multiple ARP targets must be separated by commas as follows::
2208 connected via multiple physical links, then there is no availability
2218 11.2 High Availability in a Multiple Switch Topology
2221 With multiple switches, the configuration of bonding and the
2222 network changes dramatically. In multiple switch topologies, there is
2241 switches (ISL, or inter switch link), and multiple ports connecting to
2245 11.2.1 HA Bonding Mode Selection for Multiple Switch Topology
2269 11.2.2 HA Link Monitoring Selection for Multiple Switch Topology
2280 In general, however, in a multiple switch topology, the ARP
2284 the ARP monitor should be configured with multiple targets (at least
2336 multiple physical links is, for purposes of configuring bonding, the
2382 TCP/IP connection to stripe traffic across multiple
2481 "local" network configuration, this mode balances multiple
2515 12.2 Maximum Throughput in a Multiple Switch Topology
2518 Multiple switches may be utilized to optimize for throughput
2541 performance, for example), using multiple smaller switches can be more
2550 12.2.1 MT Bonding Mode Selection for Multiple Switch Topology
2563 12.2.2 MT Link Monitoring for Multiple Switch Topology
2643 the interfaces attached to the bond may occupy multiple ports on a
2645 ports, the bond device receives multiple copies of the same packet
2713 multiple switch topology (one or more ESMs, zero or more PMs). It is
2715 much like the example in "High Availability in a Multiple Switch